Non-contacting support for a wafer
US6283827A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 1999 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Feb 9, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one type of planarizing machine, a wafer is maintained with its fragile processed side facing downward as the wafer is passed from a robot to a load station and from the load station to a spindle carrier, and then returned from the spindle carrier to the load station to the robot. These transfers must be accomplished without anything solid contacting the downwardly facing side of the wafer. This is accomplished by supporting the wafer, while it is on the load station, on cushions of purified water. The cushions are formed at three spaced areas on the lower side of the wafer by upwardly-directed nozzles located below the wafer. The purified water is discharged with sufficient force to prevent the wafer from contacting the nozzles. The use of three separate cushions insures stability of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.