Method for making connections to a microelectronic device having bump leads
US6286205A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1998 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Dec 10, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making connections to a microelectronic device having bump leads thereon. A substrate is provided having a front surface and a plurality of electrically conductive posts extending upwardly from the front surface. The posts are disposed in groups, wherein the posts of each group define a gap therebetween. Contacts are provided extending generally horizontally outwardly from each post remote from the front surface of the substrate. The microelectronic device is assembled to the substrate and posts so that the bump leads penetrate into the gaps and engage the contacts which wipe against the bump leads as they are inserted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.