Longer lifetime warm-up wafers for polishing systems
US6287173A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2000 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Jan 11, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for preparing a chemical mechanical polishing apparatus for polishing product substrates includes polishing designated "warm-up" substrates until polishing pad characteristics have achieved steady state conditions. The reusable warm-up substrates may be formed of a mechanically resistant material or a material having substantially the same removal characteristic as the product film to be polished. The reusable warm-up substrates may also be formed of a mechanically resistant film formed over a semiconductor substrate. The polishing pad characteristic of pad compression may be determined using a previously established correlation or it may be measured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.