Warpage compensating heat spreader
US6288900A · kind A · utility
42Cited by
8References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1999 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Dec 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.