Seungbae Park
8Patents
4h-index
12Co-inventors
54Inventor score
Filing activity: Nov 3, 1998 → May 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6288900A | Warpage compensating heat spreader | Electricity | 42 | Expired |
| US6627998B1 | Wafer scale thin film package | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6347901B1 | Solder interconnect techniques | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6291776A | Thermal deformation management for chip carriers | Electricity | 7 | Expired |
| US9891048B2 | Measurement equipment | Physics | 3 | Active |
| US7348261B2 | Wafer scale thin film package | Emerging Cross-Sectional Technologies | 2 | Expired |
| US11663081B2 | Storage system and method for data recovery after detection of an uncorrectable error | Physics | 1 | Active |
| US10222209B2 | Measurement equipment | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.