Thermally efficient semiconductor chip
US6292367A · kind A · utility
22Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2000 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Jun 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15312
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly and process for fabricating the assembly in which a semiconductor chip is formed with at least one high conductivity layer on its back side and some of the integrated circuits are high power circuits and, during operation, generate "hot spots" of high temperature but, due to the presence of the high conductivity layer, the "hot spots" are dissipated and the maximum chip temperature is lowered to create a uniform and lower temperature across the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.