Polishing device
US6293858A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1999 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Dec 6, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish includes a turntable with a polishing cloth mounted on an upper surface thereof and a top ring for polishing a semiconductor wafer to a flat mirror finish by placing the semiconductor wafer between the turntable and the top ring and pressing the semiconductor wafer under a certain pressing force. A presser ring is vertically movably provided around the top ring. A pressing device presses the presser ring against the polishing cloth under a variable pressing force, and the presser ring is supported by the top ring through a bearing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.