Transferable resilient element for packaging of a semiconductor chip and method therefor
US6294040A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1997 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Jun 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts, juxtaposing the first and second microelectronic elements with one another, bonding electrically conductive parts of the microelectronic elements together to form electrical interconnection, providing a resilient element having one or more tacky surface regions in contact with one or more liners separately from the first and second microelectronic elements, assembling the resilient element with at least one of said microelectronic elements, and removing the resilient element from the one or more liners prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps. In other embodiments, the method of making a microelectronic package includes providing a resilient element having one or more tacky surface regions separately from the first and second microelectronic elements, and assembling the resilient elements with at least one of the microelectronic elements prior to the juxtaposing step so that the resilient element is disposed between the microelectron…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.