Post-treatment for copper on printed circuit boards
US6294220A · kind A · utility
10Cited by
21References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1999 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Jun 30, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C22/83
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A post-treatment method for copper on printed circuit boards is disclosed. The method comprises forming a cupric-based organometallic conversion coating on a copper surface of a printed circuit board, and then converting the cupric-based organometallic conversion coating to a cuprous-based organometallic conversion coating. The resulting cuprous-based organometallic conversion coating is desirable in that it improves copper to dielectric bond integrity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.