Highly integrated chip-on-chip packaging
US6294406A · kind A · utility
80Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1999 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Jul 6, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.