Single mask process for manufacture of fast recovery diode
US6294445A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2000 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Feb 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D8/60
Abstract
A single mask process for manufacture of a FRED employs a thick oxide layer over an N type silicon surface and a thin nitride layer over the oxide. A single mask defines FRED device spaced P diffusions. The oxide spanning the P diffusions is laterally etched away, under the nitride layer to expose the surface of adjacent P diffusions and the spanning N type silicon surface. All nitride is then removed and a top contact layer of aluminum is applied atop the silicon surface, contacting a P guard ring diffusion; the surface of the P diffusions defining PN junctions; and the top of the N silicon to define a Schottky diode contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.