Method and apparatus for optical monitoring in chemical mechanical polishing
US6296548A · kind A · utility
86Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2000 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Jun 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.