Boguslaw A. Swedek
177Patents
23h-index
74Co-inventors
93Inventor score
Filing activity: Nov 2, 1998 → Mar 13, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6190234A | Endpoint detection with light beams of different wavelengths | Performing Operations; Transporting | 174 | Expired |
| US6159073A | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Physics | 174 | Expired |
| US6280289A | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers | Electricity | 131 | Expired |
| US6296548A | Method and apparatus for optical monitoring in chemical mechanical polishing | Electricity | 86 | Expired |
| US7018271B2 | Method for monitoring a substrate during chemical mechanical polishing | Physics | 84 | Expired |
| US6247998A | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing | Performing Operations; Transporting | 78 | Expired |
| US6399501B2 | Method and apparatus for detecting polishing endpoint with optical monitoring | Electricity | 67 | Expired |
| US7112960B2 | Eddy current system for in-situ profile measurement | Electricity | 62 | Expired |
| US7097537B1 | Determination of position of sensor measurements during polishing | Performing Operations; Transporting | 54 | Expired |
| US6924641B1 | Method and apparatus for monitoring a metal layer during chemical mechanical polishing | Physics | 46 | Expired |
| US7409260B2 | Substrate thickness measuring during polishing | Electricity | 43 | Active |
| US6939198B1 | Polishing system with in-line and in-situ metrology | Electricity | 39 | Expired |
| US6652355B2 | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers | Electricity | 38 | Expired |
| US6383058B1 | Adaptive endpoint detection for chemical mechanical polishing | Physics | 36 | Expired |
| US7008295B2 | Substrate monitoring during chemical mechanical polishing | Performing Operations; Transporting | 36 | Expired |
| US7513818B2 | Polishing endpoint detection system and method using friction sensor | Physics | 32 | Expired |
| US7016795B2 | Signal improvement in eddy current sensing | Physics | 32 | Expired |
| US7406394B2 | Spectra based endpointing for chemical mechanical polishing | Electricity | 29 | Expired |
| US7074109B1 | Chemical mechanical polishing control system and method | Electricity | 28 | Expired |
| US6975107B2 | Eddy current sensing of metal removal for chemical mechanical polishing | Physics | 27 | Expired |
| US6506097B1 | Optical monitoring in a two-step chemical mechanical polishing process | Electricity | 27 | Expired |
| US6966816B2 | Integrated endpoint detection system with optical and eddy current monitoring | Physics | 25 | Expired |
| US6524165B1 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Physics | 25 | Expired |
| US7008296B2 | Data processing for monitoring chemical mechanical polishing | Performing Operations; Transporting | 22 | Expired |
| US6878038B2 | Combined eddy current sensing and optical monitoring for chemical mechanical polishing | Physics | 21 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.