Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6296557A · kind A · utility
100Cited by
8References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 1999 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Apr 2, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and an apparatus for releasably attaching a polishing pad to a support surface under the polishing pad. In one embodiment of the invention, a polishing pad has a first surface for planarizing a substrate assembly, a second surface contacting the support surface, and an interlocking element. The support surface has a retaining member configured to engage the interlocking element on the polishing pad. The interlocking element and retaining member can be any one of several configurations, including: tongue and groove, protuberance and depression, reciprocal elongated ridges, or teeth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.