Structuring process

US6296777A · kind A · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Manfred Engelhardt · Feldkirchen-Westerham, DE
• Volker Weinrich · Paris, FR

Key dates

• Filing date: Aug 3, 1998
• Grant date: Oct 2, 2001
• Expiry date: Aug 3, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/32139
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A layer is structured by first applying a sacrificial layer on the layer to be structured, forming a mask with an inorganic material on the sacrificial layer, then patterning the sacrificial layer and the layer to be structured through the mask, and, finally, removing the sacrificial layer and the mask.