Method for producing contact structures
US6297164A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1998 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4015
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A production method for forming contact structures on a planar surface of a substrate and removing therefrom to mount the contact structures on a contact substrate. The contact structure is formed of a base beam which is attached to a surface of the contact substrate in a vertical direction, a horizontal beam which is connected to the base beam at one end, and a top beam formed on another end of the horizontal beam and is oriented in the vertical direction. The production method includes the steps of forming a sacrificial layer on a silicon substrate, forming, exposing and developing a photoresist layer, depositing conductive material on the photoresist layer to form the contact structures, and removing the photoresist layer and the sacrificial layer to separate the contact structures from the silicon substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.