Stackable ceramic FBGA for high thermal applications
US6297548A · kind A · utility
217Cited by
47References
46Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 30, 1999 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Jun 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus package for high temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.