Semiconductor flip-chip assembly with pre-applied encapsulating layers
US6297560A · kind A · utility
169Cited by
11References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1998 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Aug 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration having a flexible tape lamination for underfill encapsulation. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate and provides enhanced ruggedness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.