Heat sink with alignment and retaining features
US6297960A · kind A · utility
119Cited by
52References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1999 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Jun 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24298
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.