Method and apparatus for processing substrate
US6299697A · kind A · utility
12Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2000 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Aug 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate is processed with a first process solution prepared by mixing sulfuric acid with a hydrogen peroxide solution, followed by processing the substrate with a second process solution. After the substrate is processed with the first process solution, the supply of sulfuric acid is stopped, with the hydrogen peroxide alone being supplied to the substrate. Then, the supply of the hydrogen peroxide solution is stopped, and the substrate is rinsed with a second process solution. The particular processing makes it possible to prevent the second process solution from reacting with sulfuric acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.