Double pressure vessel chemical dispenser unit
US6299753A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 1999 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Sep 1, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention generally provides a fluid delivery system with particular application to electroplating. Two or more reservoirs are fluidly connected to one or more processing chambers by fluid delivery lines. A gas source is coupled to the reservoirs to selectively pressurize the reservoirs and cause fluid flow therefrom to the processing chambers through the fluid delivery lines. The fluid levels in the reservoirs and the processing chambers are controlled to facilitate avity-assisted flow of fluid from the processing chambers to the reservoirs via the fluid delivery line when the fluid levels in the processing chambers are higher than the fluid levels in the reservoirs. In operation, the reservoirs are alternately filled and emptied with a fluid circulated between the reservoirs and the processing chambers. Alternately filling and emptying the reservoirs relative to one another at constant rates maintains the fluid level and flow rate in the processing chamber substantially constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.