Structure, materials, and methods for socketable ball grid
US6300164A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2000 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Apr 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/256
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.