System for testing semiconductor components having flexible interconnect
US6300782A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2001 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Jun 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for testing semiconductor components includes a testing apparatus, such as a test carrier for discrete components, or a wafer prober for wafer sized components The system also includes an interconnect for electrically engaging the components. The interconnect includes a thinned substrate, and first contacts on the substrate for electrically engaging second contacts on the components. The thinned substrate has a thickness that is substantially less than a thickness of the components being tested. The thinned substrate can flex upon application of a biasing force by the testing apparatus, permitting the first contacts to move in the z-direction to accommodate variations in the planarity of the second contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.