Temperature control system for plasma processing apparatus
US6302966A · kind A · utility
20Cited by
14References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1999 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Nov 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32522
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing system that includes a temperature management system and method that can achieve very accurate temperature control over a plasma processing apparatus is disclosed. In one embodiment, the temperature management system and method operate to achieve tight temperature control over surfaces of the plasma processing apparatus which interact with the plasma during fabrication of semiconductor devices. The tight temperature control offered by the invention can be implemented with combination heating and cooling blocks such that both heating and cooling can be provided from the same thermal interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.