Substrate removal as a function of resistance at the back side of a semiconductor device
US6303396A · kind A · utility
7Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1999 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Sep 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resistance monitoring approach is used for removing substrate from a back side of a semiconductor device. According to an example embodiment of the present invention, substrate is removed from a semiconductor device having a circuit side opposite the back side and a resistance path in silicon substrate. The change in resistance of the resistance path is monitored. The change in resistance provides an indication of the progress of the substrate removal process. Using the change in resistance, the substrate removal process is controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.