Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6306008A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 31, 1999 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Aug 31, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.