Technique for attaching die to leads
US6307254A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 19, 1999 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Jan 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.