Method of manufacturing components and component thereof
US6310403A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2000 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Aug 31, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing components includes providing a substrate (110, 531, 631, 700) having a first coefficient of thermal expansion (CTE), having a first surface (111), and supporting a first plurality of interconnects located over the first surface in a first predetermined pattern. The method also includes providing another substrate (190) having a second CTE, having a second surface (195), and supporting a second plurality of interconnects located over the second surface in a second predetermined pattern. The method further includes assembling together the two substrates at a first temperature outside of a temperature range of approximately 25 to 30.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.