Patterned polishing pad for use in chemical mechanical polishing of semiconductor wafers
US6315645A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1999 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Apr 14, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A patterned polishing pad adapted for use in a wafer polishing machine. The patterned polishing pad has a polishing surface adapted to contact frictionally a semiconductor wafer being polished in a chemical mechanical polishing machine. The polishing surface has a first region and a second region. The first region is adapted to contact frictionally the wafer and achieve a first process effect. The second region is adapted to contact frictionally the wafer and achieve a second process effect. The surface of the second region extends a predetermined protrusion amount above the polishing surface with respect to the surface of the first region. In so doing, the wafer polishing machine achieves a customized process effect by moving the wafer frictionally against the first region with a down force operable for compressing the protrusion amount of the second region, and moving the wafer frictionally against the second region wherein the protrusion amount prevents the wafer from effectively contacting the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.