Polishing pad shaping and patterning
US6315857A · kind A · utility
19Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1998 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Jul 10, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.