Structuring method
US6315913A · kind A · utility
5Cited by
11References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1998 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Sep 3, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for structuring at least one layer to be structured. Initially, a mask is applied to the layer and the layer is structured using the mask. After the structuring step, the mask is then removed, while leaving behind redepositions of the material of the layer. The redepositions of the material of the layer are then removed by sound action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.