Deadhesion method and mechanism for wafer processing
US6316363A · kind A · utility
17Cited by
54References
183Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1999 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Sep 2, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing semiconductor devices using an improved planarization processes for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed flexible planar interface material contacting the deformable coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.