Interconnection device for low and high current stress electromigration and correlation study
US6320391A · kind A · utility
36Cited by
2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 8, 1998 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | May 8, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2853
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An interconnection test structure for evaluating more accurately and reliably electromigration characteristics is provided. The test structure includes an elongated metal test conductor having a first end and a second end, small extension metal conductors connected to the first end and the second end of the test conductor, and a plurality of vias disposed in the small extension metal conductors adjacent the first end and the second end of the test conductor. As a result, the current density of the plurality of vias is made to be less than the current density of the test conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.