Apparatus and method for inserting a wafer, substrate or other article into a process module
US6322313A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2000 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Jul 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for inserting and removing a wafer into and from a plating apparatus, includes an elongated primary arm having a wafer seat for supporting the wafer, an elongated secondary arm for supporting the primary arm, and a mounting surface for supporting the secondary arm. The apparatus further includes a drive band mechanically coupled to the primary arm for causing the movement thereof. The drive band includes a portion wound around a drum that is driven by a motor. The motor, in rotating the drum, causes the drive band to move the primary arm along an axis between a retracted position wherein the primary arm, the secondary arm, and the mounting surface are in a stacked relationship, and an extended position wherein the secondary arm protrudes from the mounting surface along the axis, and the primary arm protrudes from the secondary arm along the axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.