Wafer coating method for flip chips
US6323062A · kind A · utility
10Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1999 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Sep 14, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for applying an underfill and edge coating to a flip chip is described. The method includes the steps of adhering a bumped wafer to an expandable carrier substrate, sawing the wafer to form individual chips, stretching the carrier substrate in a bidirectional manner to form channels between each of the individual chips, applying an underfill material to the bumped surfaces of the chips and around the edges of the chips, cutting the underfill material in the channels between the chips and removing the individual, underfill coated chips from the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.