Apparatus and method for rapid photo-thermal surface treatment
US6325078A · kind A · utility
21Cited by
12References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 7, 1998 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Jan 7, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for surface treating a semiconductor wafer includes a surface treatment chamber and a source of radiation. The semiconductor wafer disposed inside the c amber is illuminated with radiation sufficient to create a plurality of electron-hole pairs near the surface of the wafer and to desorb ions and molecules adsorbed on the surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.