Integrated wafer temperature sensors

US6325536A · kind A · utility

Assignee

• Sensarray Corporation · US

Inventors

• Wayne G. Renken · San Jose, US
• Mei Sun · Milpitas, US
• Paul V. Miller · Fremont, US
• Roy Gordon · San Francisco, US
• Peter Michael Noel Vandenabeele · Lier, BE

Key dates

• Filing date: Jul 10, 1998
• Grant date: Dec 4, 2001
• Expiry date: Jul 10, 2018

Classification

• Technology area (CPC G): Physics
• CPC primary: G01K11/3213
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Systems and methods are described for integrated (embedded) semiconductor wafer temperature measurement equipment and processes. An integrated wafer temperature measurement apparatus, comprising: a substrate; a placement resource formed in said substrate; a sensor lead located in said placement resource, said sensor lead having a first end and a second end; a sensor coupled to said first end of said sensor lead and located in said placement resource; and a sensor lead cover coupled to said substrate. The systems and methods provide advantages in that reliability is enhanced, installation and removal are facilitated, and accuracy is improved by obviating any shadowing of the substrate and reducing temperature gradients near the sensor.