Piezo-actuated CMP carrier
US6325696A · kind A · utility
26Cited by
25References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1999 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Sep 13, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical polishing (CMP) control system controls distribution of pressure across the backside of a semiconductor wafer being polished. The system includes a CMP apparatus having a carrier for supporting a semiconductor wafer. The carrier includes a plurality of dual function piezoelectric actuators. The actuators sense pressure variations across the semiconductor wafer and are individually controllable. A control is connected to the actuators for monitoring sensed pressure variations and controlling the actuators to provide a controlled pressure distribution across the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.