Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices
US6326698A · kind A · utility
265Cited by
8References
54Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2000 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Jun 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate. In addition, the invention encompasses forming a similar layer on a second substrate to be joined to the first substrate. Contact pads of the second substrate are exposed through the layer thereon to facilitate joining of the two substrates. Semiconductor devices formed by the method are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.