Bump bonding device and bump bonding method
US6328196A · kind A · utility
4Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1998 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Dec 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.