Patent · US Expired

Process for selective soldering

US6328200A · kind A · utility

2Cited by

17References

14Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Jürgen Schredl · Mering, DE
Paul Kasulke · Berlin, DE

Key dates

Filing date	Feb 26, 1999
Grant date	Dec 11, 2001
Priority date	—
Expiry date	Feb 26, 2019

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0557
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Process for the selective formation of contact metallisations on terminal areas of a substrate, wherein the surface of the substrate is covered with a template in such a way that template openings forming deposit spaces are arranged above the terminal areas, and wherein the deposit spaces are filled with a solder material, and fusing of the solder material is effected with a view to forming the contact metallisations in the deposit spaces which are non-wettable at least in regions of contact with the solder material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.