Grid array assembly of circuit boards with singulation grooves
US6329606A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1998 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Dec 1, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A grid array assembly is provided employing a thin copper or steel carrier frame having apertures extending longitudinally of the frame. A series of semi-flexible substrate printed circuit boards are mounted in seriatim to peripheral edges of the apertures, the circuit boards including bonding pads and metallization on a first surface and conductive vias in the circuit boards extending to a second opposite surface containing a contact pad array. The carrier strip with the mounted circuit boards are passed to a station where an IC die is mounted on the board first surface, wire bonds are placed from the die to the bonding pads and the assembly encapsulated using a portion of the carrier strip as a mold gate to form a package body. Subsequently each grid array assembly is singulated from the carrier strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.