Semiconductor device and mounting structure
US6329711A · kind A · utility
81Cited by
29References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1998 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding from a mounting surface of the resin package, metallic film parts provided to the resin projections, connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts, and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.