Polishing pad having open area which varies with distance from initial pad surface
US6331137A · kind A · utility
17Cited by
10References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1998 |
| Grant date | Dec 18, 2001 |
| Priority date | — |
| Expiry date | Aug 28, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad having a cross-sectional open area which varies with depth from the pad surface is provided. The cross-sectional open area of the pad may increase and/or decrease moving away from the outer pad surface. In some cases, the cross-sectional open area of the pad varies uniformly with depth over the entire pad. In other cases, certain regions of the pad may define local cross-sectional open areas which vary differently. This can, for example, allow the open area of the pad to vary with pad life and improve or tailor the polishing uniformity of the pad and/or extend the useful life of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.