Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
US6331139A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2001 |
| Grant date | Dec 18, 2001 |
| Priority date | — |
| Expiry date | Feb 27, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.