Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor
US6332268A · kind A · utility
9Cited by
14References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1999 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Mar 16, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.