Transfer device centering method and substrate processing apparatus
US6332751A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2000 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Mar 30, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H9/20
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
In centering a transfer device so that tweezers of the transfer device transfer a substrate to a predetermined delivery position on a spin chuck when the substrate is delivered to a coating unit by means of the transfer device, the substrate is transferred onto the spin chuck in the coating unit by means of the tweezers, a positional deviation amount of the substrate with respect to the delivery position on the chuck is detected by a detecting device, a positional deviation amount of the tweezers is computed based on this detection value, and a position at which the tweezers deliver the substrate is corrected based on the positional deviation amount of the tweezers. Thus, centering of the substrate transfer device can be performed automatically in a short time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.