Polishing method and polishing device
US6332830A · kind A · utility
19Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2000 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Mar 24, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.