Hisashi Masumura
35Patents
14h-index
40Co-inventors
77Inventor score
Filing activity: Mar 21, 1994 → Jan 28, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5942445A | Method of manufacturing semiconductor wafers | Electricity | 97 | Expired |
| US5800725A | Method of manufacturing semiconductor wafers | Electricity | 49 | Expired |
| US6135854A | Automatic workpiece transport apparatus for double-side polishing machine | Performing Operations; Transporting | 37 | Expired |
| US5951374A | Method of polishing semiconductor wafers | Performing Operations; Transporting | 33 | Expired |
| US5494862A | Method of making semiconductor wafers | Emerging Cross-Sectional Technologies | 32 | Expired |
| US7582221B2 | Wafer manufacturing method, polishing apparatus, and wafer | Performing Operations; Transporting | 28 | Expired |
| US6042688A | Carrier for double-side polishing | Performing Operations; Transporting | 23 | Expired |
| US6120353A | Polishing method for semiconductor wafer and polishing pad used therein | Performing Operations; Transporting | 22 | Expired |
| US5914053A | Apparatus and method for double-sided polishing semiconductor wafers | Performing Operations; Transporting | 22 | Expired |
| US6332830A | Polishing method and polishing device | Performing Operations; Transporting | 19 | Expired |
| US5827779A | Method of manufacturing semiconductor mirror wafers | Chemistry; Metallurgy | 16 | Expired |
| US6306021A | Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers | Performing Operations; Transporting | 16 | Expired |
| US5447890A | Method for production of wafer | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5821167A | Method of manufacturing semiconductor mirror wafers | Electricity | 14 | Expired |
| US6422922B1 | Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece | Performing Operations; Transporting | 12 | Expired |
| US6386957B1 | Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus | Performing Operations; Transporting | 8 | Expired |
| US5759087A | Method for inducing damage for gettering to single crystal silicon wafer | Electricity | 8 | Expired |
| US9266216B2 | Polishing head and polishing apparatus | Electricity | 6 | Active |
| US5790252A | Method of and apparatus for determining residual damage to wafer edges | Electricity | 6 | Expired |
| US8268114B2 | Workpiece holder for polishing, workpiece polishing apparatus and polishing method | Performing Operations; Transporting | 5 | Expired |
| US5866226A | Polishing agent used for polishing semiconductor wafers and polishing method using the same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7740521B2 | Polishing head, polishing apparatus and polishing method for semiconductor wafer | Performing Operations; Transporting | 5 | Expired |
| US5827395A | Polishing pad used for polishing silicon wafers and polishing method using the same | Performing Operations; Transporting | 5 | Expired |
| US5705423A | Epitaxial wafer | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5891353A | Polishing agent used for polishing semiconductor wafers and polishing method using the same | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.