Method for controlling the texture and microstructure of plated copper and plated structure

US6333120A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Patrick W. DeHaven · Poughkeepsie, US
• Peter S. Locke · New York, US
• Kenneth P. Rodbell · Sandy Hook, US
• Cyprian Emeka Uzoh · San Jose, US

Key dates

• Filing date: Oct 27, 1999
• Grant date: Dec 25, 2001
• Expiry date: Oct 27, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12528
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Copper is plated onto a substrate by plating a layer of copper onto the substrate to provide a maximum thickness of about 350 nanometers, followed by subjecting the copper coated substrate to an oxygen containing gaseous ambient in order to roughen the copper surface. Next, a second layer of copper is electroplated onto the structure to provide the desired thickness. The texture of the second layer of copper is independent of the underlayer of copper and has a random or at least substantially random texture.